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HED’s Chip Showed up at the Cards & Payment Asia 2014 in Singapore

Source: 華大電子
 Release Time: 2014-04-25

On April 23 - 24, HED was invited to the Cards and Payment Asia 2014. The Cards and Payment Asia 2014 is one of the most influential professional smart card exhibitions in Asia-Pacific region. At this exhibition, HED showed the chips and solutions in the fields of telecommunication, mobile payment, transport, micro payment etc., and shared its rich application experience with the industry professionals from various countries and regions such as Southeast Asia, Japan, Korea, Egypt, Russia and Australia. 


HED is a famous Chinese IC design company, which is one of the most comprehensive in technology and widest in application among the smart card and safety chip companies in China. Its annual chip shipments has exceeded 1 billion units. Entering the mobile communication field in 2007. now the company has become the main supplier of SIM card chips for the three top telecommunication operators in China with the accumulated shipments of this kind of chips surpassing 2.6 billion units. Its products have been exported to overseas markets. In order to promote the development of SIM card markets, HED is the first Chinese enterprise that has introduced 55nm process into chip development. The launch of such chips is bound to provide the customers with more competitive product applications. In the field of mobile payment, the company has introduced the high-safety, large-capacity and multi-interface chips, which supports various main stream solutions such as SWP-SIM, NFC-SD and eSE. The stability of these products is fully approved by the customers. HED is also the first enterprise that has introduced the dual-interface IC card chip in China. And now the non-contact/dual-interface IC card chip series supporting various capacities and algorithms have been established. Such products have been used widely in the fields of transport, micro payment, access etc.

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